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Paul England on DVLED Pixel Packaging, Coating Options and InfoComm Plans

Published: May 19, 2026
Image composed by CI Staff.

Key Takeaways

  • No single DVLED pixel package fits every application
  • SMD remains common and effective for many installs
  • COB can offer durability but may bring repair and glare limits
  • MIP aims to combine fine pitch, performance and repairability
  • SNA plans to show MIP, THRUMEDIA® and QUASAR LED Diagnostics and Calibration Platform at InfoComm
  • England stresses planning around content, processing and system details

DVLED options keep expanding, but more choice has also made specification more complex. In a video Q&A with Commercial Integrator, Senior Editor Alyssa Borelli and Paul England, senior director of design solutions at SNA Displays, outlined how to evaluate pixel packaging choices, what the company plans to highlight at InfoComm 2026 and where he sees attention shifting in real-world deployments.

Rather than frame one technology as the answer for every project, England describes the decision process as application-driven. That theme carried through the discussion, from surface mounted device (SMD) and chip-on-board (COB) to newer microLED-in-package (MIP) designs, as well as to software, large venue deployments and the system planning that supports long-term performance.

Watch the full interview below:

What should integrators know about DVLED pixel packaging options?

Integrators should know that each DVLED pixel packaging option involves trade-offs. England says the market has become crowded with terms and claims, but the practical question is still which technology best matches the job.

He points to a common mistake in the market: treating one packaging type as a universal fix. In practice, he says, some approaches are stronger in durability, some in brightness and some in color performance. The right choice depends on the environment, service expectations and viewing conditions.

England also notes that product quality can vary widely across the category, not just by technology label but by how well the pixels and components are made. That makes it important for integrators to look past buzzwords and evaluate performance in context.

How do SMD, COB and MIP compare in real applications?

Surface Mounted Devices (SMD), chip-on-board (COB) and microLED-in-package (MIP) each offer distinct strengths and limitations. England says SMD remains the dominant format in the market and continues to perform well in many applications despite being viewed by some as an older technology.

According to England, SMD still looks strong and should remain relevant for a long time. He also notes that it can be a good fit in settings where a matte finish helps control reflections.

COB, by contrast, stands out for durability and can deliver strong performance in the right use cases. But England says COB also comes with drawbacks. While boards may be technically repairable, he suggests they are often not practicably repairable in the field. That can create challenges for long-term installations where spare strategy matters.

He also points to surface reflectivity as another concern. Because of the epoxy process, COB can appear shinier, which may make it less ideal in high-glare spaces or areas with heavy ambient light.

MIP is the newest option. England says SNA introduced the technology at ISE 2024 and positions it as a flip-chip approach that brings subpixels from a chip-on-board-type product into a repairable format. He says MIP supports very fine pixel pitches, down to 0.4 mm, while also addressing some of the repair and performance concerns tied to other approaches. In his view, it comes closest to solving multiple packaging challenges at once.

What will SNA Displays show at InfoComm 2026?

SNA Displays plans to show its microLED-in-package (MIP), THRUMEDIA®  and its QUASAR software platform at InfoComm. England says the company does not exhibit every year, so returning with a booth signals that it has several notable products to highlight.

On the display side, the company expects to feature MIP in 0.7 mm and 0.9 mm packages. England presents that as a chance for attendees to assess the performance firsthand.

SNA also plans to show its latest display offering, THRUMEDIA®, in multiple packages.

A major software focus will be the QUASAR LED Diagnostics and Calibration Platform, a new brand for the company’s growing suite of operations tools. England says the software platform covers configuration, remote management and service functions. He adds that the platform is built to support broad deployments, including cases where operators need to manage many displays across a single property or network.

As an example, he points to American Dream, where SNA manages more than 300 displays. QUASAR supports remote diagnostics and firmware updates across those systems, and England notes that remote management is included with the displays rather than tied to an added monthly fee.

Which recent projects reflect where the market is heading?

Recent projects suggest continued demand for large, high-visibility deployments supported by broad system management. England points to work at Truist Park as one example.

He says SNA delivered a range of displays not only inside the Atlanta Braves’ stadium but also in guest areas and in The Battery Atlanta, the adjacent entertainment district. DVLED is now extending beyond a main venue screen into connected fan and visitor environments.

England also highlights a forthcoming Times Square project that he describes as especially significant. Without naming the customer, he says the display is under construction on the northwest corner and will wrap an entire building. He notes that SNA already has a large footprint in Times Square and characterizes the upcoming installation as one of the most impressive displays there once it launches.

What should integrators should pay closer attention to?

Integrators should pay closer attention to the systems around the display, not just the display itself. England says it is easy to focus on the LED product while overlooking playback systems, upstream video processing, content planning and even basic interconnect choices.

Content is one of his clearest warnings. He says the best time to think about content is early, and delaying those decisions can limit the quality of upstream system selections. That message aligns with a broader industry lesson: display hardware and content strategy need to be developed together.

He also stresses the importance of dependable infrastructure. A premium display, he notes, can still fail in practice if a low-cost cable or weak system detail causes downtime.

His broader advice is straightforward: plan early, plan thoroughly and pay attention to the full signal chain.

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