As the commercial AV world prepares for ISE 2023 later this month, Valens Semiconductor is grabbing the industry’s attention. The company, which is one of the cofounders of the HDBaseT Alliance, will have a technology-packed booth in Barcelona. To give Commercial Integrator readers a sneak peek at Valens’ plans, we caught up with Gabi Shriki, head of audio video business. In the 10-minute interview below, Dan Ferrisi, editor-in-chief, inquires about everything that showgoers can look forward to seeing.
At the top, Shriki emphasizes the new capabilities of Valens’ VS3000 Stello Family chipset. Notably, it leverages the Dual HDBaseT Digital Interface (DHDI) chip-to-chip interconnect. DHDI enables new applications for the growing verticals of unified communications and collaboration (UC&C) and digital signage. Shriki offers a detailed explanation, and he uses visuals to enhance understanding.
Next, Shriki turns to Valens’ plans to showcase a USB Type-C professional-grade extension solution at its ISE 2023 booth in Barcelona. The extension solution will enable vendors to develop innovative products for UC&C BYOD applications. Valens’ HDBaseT technology extends the very same interfaces that USB-C connectors carry.
Finally, Shriki turns to Valens’ plans to unveil an innovative videoconferencing multi-camera solution with its new VA7000 chipset CSI extension technology. The CSI extension technology will enable high-performing, uncompressed distribution of multiple cameras in a highly cost-effective manner.
For more details about all of these, as well as to see illuminating graphic illustrations, watch the complete video. And be sure to visit the Valens booth at ISE 2023 later this month!
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